Today's high-power electronic and optical devices require better heat transfer to the heat sink. Gold-tin (AuSn) solder is the answer to such packaging challenges. This is because AuSn solder has superior high-temperature performance, excellent electrical and thermal conductivity, high mechanical strength, and fluxless soldering [1].
Today I read from nLight's website [2] that they use AuSn soldering of high-power diode emitters onto the coefficient-of-thermal-expansion (CTE) matched heatsinks (such as BeO). Compared to the traditional indium soldering ("soft soldering") onto copper heatsink, the AuSn soldering ("hard soldering") has significantly increased reliability.
References:
[1] http://www.flipchips.com/tutorial46.html
[2] http://nlight.net/nlight-files/file/technical_papers/LEOS2008-AnnualMeeting_Leisher.pdf
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